FREE WHEELING DIODE, HIGH RELIABILITY, LOW POWER LOSS
Application:
EFFICIENCY
Case Connection:
ISOLATED
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.3 V
JEDEC-95 Code:
TO-220AB
JESD-30 Code:
R-PSFM-T3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
125 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
5 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Reference Standard:
IEC-61249-2-21; UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
400 V
Reverse Current-Max:
10 µA
Reverse Recovery Time-Max:
0.035 µs
Reverse Test Voltage:
400 V
Surface Mount:
NO
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
SFF1006G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer. This helps to dissipate heat efficiently. Additionally, it's recommended to use vias to connect the thermal pad to the copper area to reduce thermal resistance.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and avoid overheating the device.
Although the datasheet specifies the recommended operating voltage range, it's essential to note that the input pins have a maximum allowable voltage of 5.5V to prevent damage to the device. Exceeding this voltage may cause permanent damage or affect the device's reliability.
To handle ESD protection for the SFF1006G, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, consider adding ESD protection devices, such as TVS diodes, to the PCB design to protect the device from electrostatic discharge.
The recommended soldering temperature for the SFF1006G is between 240°C to 260°C, with a maximum soldering time of 10 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device or the PCB.
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SFF1006G Overview
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