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SI7232DN-T1-GE3 - Vishay

Description: Dual N-Channel (D-S)MOSFET 20V Vds 8V Vgs PowerPAK 1212-8

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PCB Footprints
SI7232DN-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK1212-8_2021
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3D Models
SI7232DN-T1-GE3 - Vishay  - 3D model - Other - PowerPAK1212-8_2021
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SI7232DN-T1-GE3 Details

  • Manufacturer Part Number:

    SI7232DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    11 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.0164 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-XDSO-C6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    23 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7232DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7232DN-T1-GE3 is a standard SO-8 package with a minimum pad size of 3.5mm x 2.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
  • The maximum allowed voltage on the SI7232DN-T1-GE3's input pins is 30V, but it's recommended to keep the input voltage below 20V to ensure reliable operation.
  • The SI7232DN-T1-GE3 is rated for operation up to 150°C, but it's recommended to derate the component's power handling at high temperatures to ensure reliability. Consult the datasheet for thermal derating information.
  • To protect the SI7232DN-T1-GE3 from ESD, handle the component in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded.

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SI7232DN-T1-GE3 Overview

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