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SIB456DK-T1-GE3 - Vishay

Description: N-Channel MOSFET, 6.3 A, 100 V, 6-Pin PowerPAK SC-70 Vishay SIB456DK-T1-GE3

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PCB Footprints
SIB456DK-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SC75-6L Single
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3D Models
SIB456DK-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® SC75-6L Single
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SIB456DK-T1-GE3 Details

  • Manufacturer Part Number:

    SIB456DK-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-75, POWERPAK, 6 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    0.29 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain-source On Resistance-Max:

    0.185 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    13 W

  • Pulsed Drain Current-Max (IDM):

    7 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    40 ns

  • Turn-on Time-Max (ton):

    30 ns

SIB456DK-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIB456DK-T1-GE3 is a rectangle with dimensions of 5.08 mm x 3.81 mm, with a thermal pad in the center.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Avoid overheating the component.
  • The maximum allowed voltage derating for the SIB456DK-T1-GE3 is 80% of the maximum rated voltage, which is 45 V. Therefore, the maximum allowed voltage derating is 36 V.
  • To handle thermal management, ensure good airflow around the component, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the component.
  • The recommended storage condition for the SIB456DK-T1-GE3 is in a dry, cool place, away from direct sunlight, with a temperature range of -40°C to 125°C and humidity below 60%.

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SIB456DK-T1-GE3 Overview

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