HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8
ECCN Code:
EAR99
Factory Lead Time:
14 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
5
Avalanche Energy Rating (Eas):
5 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
40 V
Drain Current-Max (ID):
21 A
Drain-source On Resistance-Max:
0.019 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-XDSO-C5
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
15.6 W
Pulsed Drain Current-Max (IDM):
50 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
SIR836DP-T1-GE3 Frequently Asked Questions (FAQs)
The recommended PCB footprint for the SIR836DP-T1-GE3 is a pad layout with a minimum size of 2.5 mm x 2.5 mm, with a thermal pad size of 1.5 mm x 1.5 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the SIR836DP-T1-GE3 on the pads. Use a reflow oven or a hot air gun to solder the component. Make sure to follow the recommended soldering profile to prevent damage to the device.
The maximum operating temperature range for the SIR836DP-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
The SIR836DP-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use the device in a humid environment, ensure that the PCB is properly coated with a moisture-resistant material, and follow proper handling and storage procedures to minimize the risk of moisture ingress.
Store the SIR836DP-T1-GE3 in a dry, cool place with a temperature range of 20°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage.
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SIR836DP-T1-GE3 Overview
Use the download button to access the SIR836DP-T1-GE3 schematic symbol and PCB footprint.
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