SIR882DP-T1-GE3 footprint, schematic symbol and 3D model by Vishay

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PCB Footprints

SIR882DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_11

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Part Number SIR882DP-T1-GE3
Manufacturer Vishay
Pin Count 11
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - PowerPAK® SO-8 Single_11
Released Date Mar 4, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

SIR882DP-T1-GE3 Details

Manufacturer Part Number:
SIR882DP-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Not Recommended
Package Description:
HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8
ECCN Code:
EAR99
Factory Lead Time:
29 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
3
Avalanche Energy Rating (Eas):
45 mJ
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
100 V
Drain Current-Max (ID):
60 A
Drain-source On Resistance-Max:
0.0087 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-XDSO-C5
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
83 W
Pulsed Drain Current-Max (IDM):
80 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

SIR882DP-T1-GE3 Frequently Asked Questions (FAQs)

The recommended land pattern for the SIR882DP-T1-GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for QFN and DFN Packages' (document number 28353).
The thermal pad on the SIR882DP-T1-GE3 should be connected to a solid ground plane to ensure optimal thermal performance. A thermal via or a thermal pad connection to the ground plane is recommended.
The SIR882DP-T1-GE3 has an operating temperature range of -55°C to 150°C. However, the maximum junction temperature (TJ) should not exceed 150°C.
Yes, the SIR882DP-T1-GE3 is suitable for high-reliability applications. It is manufactured using a qualified process and is compliant with the Automotive Electronics Council (AEC) Q100 and Q101 standards.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note 'Soldering Guidelines for QFN and DFN Packages' (document number 28354).

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SIR882DP-T1-GE3 Overview

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