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SMBJ18A - Taiwan Semiconductor

Description: ESD Suppressors / TVS Diodes 600W 21.1V 5% Unidir ectional TVS

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Symbol
SMBJ18A - Taiwan Semiconductor - PCB symbol
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PCB Footprints
SMBJ18A - Taiwan Semiconductor PCB footprint - Other - Other - SMBJ18A-1
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3D Models
SMBJ18A - Taiwan Semiconductor - 3D model - Other - SMBJ18A-1
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SMBJ18A Details

  • Manufacturer Part Number:

    SMBJ18A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    22.1 V

  • Breakdown Voltage-Min:

    20 V

  • Breakdown Voltage-Nom:

    21.05 V

  • Clamping Voltage-Max:

    29.2 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    18 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    18 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMBJ18A Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJ18A can be found in the Taiwan Semiconductor's packaging information document or in the IPC-7351 standard. A typical footprint would be a rectangular pad with a size of around 1.3mm x 0.8mm, with a 0.5mm x 0.5mm pad in the center for the cathode.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 260°C, and avoid excessive soldering temperatures or times. Inspect the solder joints for defects such as cold joints, solder balls, or bridging.
  • The maximum allowable voltage that can be applied to the SMBJ18A is 18V, which is the breakdown voltage (VBR) of the device. Applying voltages above this may cause the device to fail or degrade over time.
  • The SMBJ18A is designed for ESD protection and is suitable for high-frequency applications up to several hundred MHz. However, the device's parasitic capacitance and inductance may affect its performance at very high frequencies. Consult the datasheet and application notes for more information.
  • The SMBJ18A has a polarity mark on the package, which indicates the cathode (K) pin. The cathode pin should be connected to the ground or a low-impedance path to ensure proper ESD protection.

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SMBJ18A Overview

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SMBJ18A Alternates

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For a full list of alternate parts for SMBJ18A, check out Findchips.com