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SMBJ26A - Taiwan Semiconductor

Description: ESD Suppressors / TVS Diodes 600 Watt TVSs

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PCB Footprints
SMBJ26A - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - SMB/DO-214AA
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3D Models
SMBJ26A - Taiwan Semiconductor  - 3D model - Diodes Moulded - SMB/DO-214AA
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SMBJ26A Details

  • Manufacturer Part Number:

    SMBJ26A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    31.9 V

  • Breakdown Voltage-Min:

    28.9 V

  • Breakdown Voltage-Nom:

    30.4 V

  • Clamping Voltage-Max:

    42.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    600 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    26 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    26 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMBJ26A Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMBJ26A can be found in the Taiwan Semiconductor's packaging information document or in the IPC-7351 standard. A typical footprint would be a rectangular pad with a size of around 1.2mm x 0.8mm, with a 0.5mm x 0.5mm pad in the center for the diode.
  • To ensure proper soldering, use a soldering iron with a temperature of around 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of bridging or cold joints. Inspect the solder joints under a microscope or with a magnifying glass to ensure they are smooth, shiny, and free of defects.
  • The SMBJ26A is rated for operation from -55°C to 150°C, but the maximum operating temperature range depends on the specific application and the power dissipation. As a general rule, the maximum operating temperature should be derated by 10°C to 20°C to ensure reliable operation.
  • To calculate the power dissipation, you need to know the voltage and current ratings of the SMBJ26A, as well as the specific application's voltage and current conditions. Use the formula P = V x I, where P is the power dissipation, V is the voltage, and I is the current. Consult the datasheet for the maximum power dissipation rating and ensure your application stays within that limit.
  • The SMBJ26A is designed to provide ESD protection up to ±30kV, exceeding the IEC 61000-4-2 standard. It can protect against electrostatic discharges, ensuring the reliability and robustness of the downstream circuitry.

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SMBJ26A Overview

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Part Image SMBJ26A International Semiconductor Inc

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