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SMCJ33CA - Taiwan Semiconductor

Description: TAIWAN SEMICONDUCTOR - SMCJ33CA - TVS Diode, TRANSZORB SMCJ Series, Bidirectional, 33 V, 53.3 V, SMD, 2 Pins

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PCB Footprints
SMCJ33CA - Taiwan Semiconductor PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - . 2-LEAD, SMC, JEDEC DO-214
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3D Models
SMCJ33CA - Taiwan Semiconductor  - 3D model - Diodes Moulded Non Polarised - . 2-LEAD, SMC, JEDEC DO-214
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SMCJ33CA Details

  • Manufacturer Part Number:

    SMCJ33CA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.7 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMCJ33CA Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for the SMCJ33CA can be found in the Taiwan Semiconductor's packaging information document or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines. Use a solder with a melting point below 240°C to prevent thermal damage. Inspect the solder joints for defects such as cold joints, bridges, or insufficient solder. Use a soldering iron with a temperature control and a flux suitable for the component's packaging.
  • The SMCJ33CA has a high power dissipation capability, but it still requires proper thermal management to prevent overheating. Ensure good thermal conductivity between the component and the PCB by using thermal vias, thermal pads, or a heat sink. Keep the component away from heat sources and ensure good airflow around the component.
  • The SMCJ33CA is sensitive to electrostatic discharge (ESD). Handle the component in an ESD-controlled environment, and use ESD-protective packaging and equipment. Ground yourself before handling the component, and use an anti-static wrist strap or mat. Avoid touching the component's pins or leads.
  • The SMCJ33CA's reliability and lifespan depend on various factors such as operating conditions, temperature, and quality of the component. Taiwan Semiconductor provides reliability data and guidelines in their documentation. Follow proper storage, handling, and operating conditions to ensure the component's lifespan.

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SMCJ33CA Overview

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For a full list of alternate parts for SMCJ33CA, check out Findchips.com