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SMDJ33CA/TR13 - Yageo Group

Description: 53.3V Clamp 56.3A Ipp Tvs Diode Surface Mount DO-214AB (SMC) -55°C ~ 150°C

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Symbol
SMDJ33CA/TR13 - Yageo Group - PCB symbol
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PCB Footprints
SMDJ33CA/TR13 - Yageo Group PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - (SMC/DO-214AB)
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3D Models
SMDJ33CA/TR13 - Yageo Group - 3D model - Diodes Moulded Non Polarised - (SMC/DO-214AB)
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SMDJ33CA/TR13 Details

  • Manufacturer Part Number:

    SMDJ33CA/TR13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    20 Weeks, 2 Days

  • Date Of Intro:

    2019-04-29

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    7.66

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    6.5 W

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Reverse Current-Max:

    2 µA

  • Reverse Test Voltage:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMDJ33CA/TR13 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMDJ33CA/TR13 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • SMDJ33CA/TR13 is a moisture-sensitive device (MSD) and requires special handling to prevent damage. It should be stored in a dry environment with a relative humidity of less than 30% and a temperature range of 10°C to 30°C. Before reflow soldering, the components should be baked at 125°C for 24 hours to remove any moisture.
  • The maximum reflow temperature for SMDJ33CA/TR13 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The reflow profile should follow the JEDEC J-STD-020 standard.
  • SMDJ33CA/TR13 is a surface-mount device and may not be suitable for high-vibration environments. The component's solder joints may be prone to fatigue and cracking under high-vibration conditions. If high vibration is expected, a more robust component or additional mechanical support may be required.
  • To ensure the reliability of SMDJ33CA/TR13 in a high-temperature environment, it is recommended to follow the derating guidelines provided in the datasheet. The component's power rating should be derated by 1.25% for every 1°C above 70°C. Additionally, the component's operating temperature should be monitored to prevent overheating.

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SMDJ33CA/TR13 Overview

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