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SML-311DTT86K - ROHM Semiconductor

Description: ROHM - SML-311DTT86K - LED, Orange, SMD, 0603, 20 mA, 1.8 V, 608 nm

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PCB Footprints
SML-311DTT86K - ROHM Semiconductor PCB footprint - LEDs Chip - LEDs Chip - SML-311
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SML-311DTT86K Details

  • Manufacturer Part Number:

    SML-311DTT86K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    1.60 X 0.80 MM, 0.80 MM HEIGHT, MINIMOLD PACKAGE-2

  • Country Of Origin:

    Japan, Mainland China, Malaysia

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Color:

    ORANGE

  • Color@Wavelength:

    Amber

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.02 A

  • JESD-609 Code:

    e4

  • Lens Type:

    COLORLESS TRANSPARENT

  • Luminous Intensity-Nom:

    5.2 mcd

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Optoelectronic Device Type:

    SINGLE COLOR LED

  • Overall Height:

    0.8 mm

  • Packing Method:

    TAPE

  • Peak Wavelength:

    611 nm

  • Reverse Voltage-Max:

    4 V

  • Shape:

    RECTANGULAR

  • Size:

    1.2 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    GOLD OVER NICKEL

  • Terminal Pitch:

    1.65 mm

SML-311DTT86K Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad size of at least 2.5mm x 2.5mm with multiple vias to the ground plane to ensure efficient heat dissipation. A thermal via diameter of 0.3mm to 0.5mm is recommended, with a minimum of 10 vias.
  • To ensure the device operates within the recommended operating conditions, it's essential to follow the recommended voltage and current ratings, as well as the thermal management guidelines. Additionally, ensure the device is operated within the specified temperature range (-40°C to 125°C) and avoid exceeding the maximum junction temperature (150°C).
  • ROHM recommends a soldering profile with a peak temperature of 260°C to 280°C, a dwell time of 10 seconds to 30 seconds, and a cooling rate of 3°C/s to 5°C/s. It's essential to follow the recommended soldering profile to prevent damage to the device.
  • To prevent damage during storage and shipping, it's recommended to store the devices in their original packaging or in a similar anti-static package. Avoid exposing the devices to moisture, direct sunlight, or extreme temperatures. Handle the devices by the edges or the body, avoiding direct contact with the pins or the thermal pad.
  • When handling the device's thermal pad, avoid touching the thermal pad with bare hands or metal objects, as this can cause damage or contamination. Use gloves or a vacuum pick-up tool to handle the device, and ensure the thermal pad is clean and dry before applying thermal interface material (TIM).

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SML-311DTT86K Overview

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