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- Stock & Prices $ Price & Stock for SRP6050CA-2R2M
- Part Number SRP6050CA-2R2M
- Manufacturer Bourns
- Last Modified Date May 16, 2024 10:48 AM UTC
- Pinout / Pin List Click Here (Member Only)
SRP6050CA-2R2M Details
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Manufacturer Part Number:
SRP6050CA-2R2M
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China, Taiwan
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Manufacturer:
Bourns Inc
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YTEOL:
7
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Case/Size Code:
2625
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Construction:
Rectangular
SRP6050CA-2R2M Frequently Asked Questions (FAQs)
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The recommended land pattern for the SRP6050CA-2R2M can be found in the Bourns application note AN-13, which provides guidelines for PCB layout and land pattern design.
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The SRP6050CA-2R2M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. A thermal pad on the bottom of the device can be connected to a copper plane on the PCB to dissipate heat.
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The recommended soldering profile for the SRP6050CA-2R2M is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. This profile ensures reliable solder joints and minimizes thermal stress on the device.
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Yes, the SRP6050CA-2R2M is designed to withstand high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent damage or detachment during vibration.
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The SRP6050CA-2R2M meets various safety certifications, including UL94V-0 and IEC 62133. To ensure compliance, follow the recommended PCB layout and assembly guidelines, and ensure that the device is used within its specified operating conditions.
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SRP6050CA-2R2M Overview
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