SS13FL footprint, schematic symbol and 3D model by onsemi

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Stock & Prices Price & Stock for SS13FL
Part Number SS13FL
Manufacturer onsemi
Pin Count 2
Part Category Diode
Package Category Small Outline Diode Flat Lead
Footprint Name Small Outline Diode Flat Lead - SOD-123F 2L
Released Date Feb 17, 2017
Pinout / Pin List Click Here (Member Only)

SS13FL Details

Manufacturer Part Number:
SS13FL
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Part Package Code:
SOD-123 FL
Package Description:
PACKAGE-2
Manufacturer Package Code:
425AD
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
onsemi
YTEOL:
0
Application:
GENERAL PURPOSE
Breakdown Voltage-Min:
30 V
Configuration:
SINGLE
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.55 V
JESD-30 Code:
R-PDSO-F2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
40 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
1 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
30 V
Reverse Current-Max:
30 µA
Reverse Recovery Time-Max:
0.005875 µs
Reverse Test Voltage:
30 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30

SS13FL Frequently Asked Questions (FAQs)

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal relief pattern can be used to reduce thermal resistance.
Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power handling at high temperatures.
A reflow soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux.
Handle the device in an ESD-controlled environment. Use ESD-protective packaging, wrist straps, and mats. Ground all equipment and personnel before handling the device. Avoid touching the device's pins or leads.
Store the device in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, direct sunlight, or extreme temperatures. Handle the device by the body, not the leads.

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