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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for ST33-75T1MI
- Part Number ST33-75T1MI
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
ST33-75T1MI Details
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Manufacturer Part Number:
ST33-75T1MI
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Pbfree Code:
No
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Rohs Code:
No
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Part Life Cycle Code:
Active
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Package Description:
AXIAL LEADED
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Reach Compliance Code:
Unknown
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8532.21.00.20
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Factory Lead Time:
14 Weeks
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Manufacturer:
Vishay Intertechnologies
ST33-75T1MI Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the ST33-75T1MI is a rectangular pad with dimensions of 5.5 mm x 3.5 mm, with a thermal pad of 2.5 mm x 2.5 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) area around the thermal pad.
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To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pads, and use a reflow oven or a hot air gun to solder the component. Avoid using excessive solder or flux, as it can cause bridging or shorts.
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The maximum operating temperature range for the ST33-75T1MI is -40°C to 150°C. However, the device can withstand short-term excursions up to 175°C during soldering or other manufacturing processes.
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Store the ST33-75T1MI in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging materials, such as ESD bags or tubes, to prevent electrostatic discharge damage. Avoid bending or flexing the leads, and handle the component by the body, not the leads.
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The ST33-75T1MI has an ESD rating of Human Body Model (HBM) 2 kV and Charged Device Model (CDM) 500 V. To prevent ESD damage, use ESD-protected workstations, wrist straps, and packaging materials. Handle the component in a static-controlled environment, and avoid touching the leads or pins.
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ST33-75T1MI Overview
Use the download button to access the ST33-75T1MI 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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