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- Stock & Prices $ Price & Stock for STE750-75T4KIE3
- Part Number STE750-75T4KIE3
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
STE750-75T4KIE3 Details
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Manufacturer Part Number:
STE750-75T4KIE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
,
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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Factory Lead Time:
14 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6
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Additional Feature:
RIPPLE CURRENT IS MEASURED AT 85 DEG CEL
STE750-75T4KIE3 Frequently Asked Questions (FAQs)
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The recommended PCB layout involves placing the STE750-75T4KIE3 near a thermal pad or heat sink to dissipate heat efficiently. A minimum of 2 oz copper thickness and a thermal via array under the device are recommended. Additionally, ensure good airflow and avoid placing heat-sensitive components nearby.
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To ensure reliable operation in high-temperature environments, follow the recommended derating curves for the device. Ensure proper heat sinking, and consider using a thermal interface material (TIM) to improve heat transfer. Also, verify that the system design can handle the increased power dissipation at higher temperatures.
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Exceeding the maximum junction temperature (Tj) rating can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It's essential to ensure that the device operates within the specified Tj range to maintain reliability and performance.
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To handle ESD protection, follow proper handling and storage procedures, such as using ESD-safe materials, grounding straps, and wrist straps. Implement ESD protection circuits, such as TVS diodes or ESD protection arrays, in the system design to prevent damage from electrostatic discharge.
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When paralleling multiple STE750-75T4KIE3 devices, ensure that each device has its own heat sink and thermal management system. Balance the current sharing between devices by using resistors or active current sharing circuits. Also, consider the increased power dissipation and thermal management requirements for the overall system.
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STE750-75T4KIE3 Overview
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