STPS30L30CG-TR footprint, schematic symbol and 3D model by STMicroelectronics

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STPS30L30CG-TR - STMicroelectronics PCB footprint - Other - Other - STPS30L30CG-TR

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Part Number STPS30L30CG-TR
Manufacturer STMicroelectronics
Pin Count 3
Part Category Schottky Diode
Package Category Other
Footprint Name Other - STPS30L30CG-TR
Released Date Oct 10, 2022
Last Modified Date Jan 8, 2026 2:31 PM UTC
Pinout / Pin List Click Here (Member Only)

STPS30L30CG-TR Details

Manufacturer Part Number:
STPS30L30CG-TR
Brand Name:
STMicroelectronics
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
TO-263
Package Description:
D2PAK-3/2
Pin Count:
3
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
25 Weeks
Manufacturer:
STMicroelectronics
YTEOL:
6.32
Additional Feature:
FREE WHEELING DIODE
Application:
FAST RECOVERY
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.57 V
JEDEC-95 Code:
TO-263AB
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
220 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Output Current-Max:
15 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
245
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
30 V
Reverse Current-Max:
1500 µA
Reverse Test Voltage:
30 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

STPS30L30CG-TR Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and ensure that the PCB is designed to minimize thermal resistance.
To ensure reliable operation at high temperatures, ensure that the device is operated within the recommended temperature range (up to 150°C for the STPS30L30CG-TR). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device. Monitor the device's junction temperature (Tj) and adjust the operating conditions accordingly.
The recommended soldering conditions for the STPS30L30CG-TR are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp-up rate of 3°C/s. Ensure that the device is handled and stored in accordance with the recommended moisture sensitivity level (MSL) of 3.
To protect the device from ESD, handle the device by the body or the pins, and avoid touching the pins or the die. Use an ESD wrist strap or mat, and ensure that the workspace is ESD-protected. Use ESD-protected packaging and storage materials, and avoid exposing the device to high humidity or temperature extremes.
The recommended storage conditions for the STPS30L30CG-TR are: temperature range of -40°C to 150°C, relative humidity of 60% or less, and protection from direct sunlight and moisture. Store the device in its original packaging or in a dry, ESD-protected environment.

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STPS30L30CG-TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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