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STW160N75F3 - STMicroelectronics

Description: STW160N75F3 N-Channel MOSFET Transistor, 120 A, 75 V STripFET F3, 3-Pin TO-247 STMicroelectronics

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STW160N75F3 Details

  • Manufacturer Part Number:

    STW160N75F3

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247AB

  • Package Description:

    ROHS COMPLIANT, TO-247, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    100 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    75 V

  • Drain Current-Max (ID):

    120 A

  • Drain-source On Resistance-Max:

    0.0045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    10 pF

  • JEDEC-95 Code:

    TO-247AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    330 W

  • Pulsed Drain Current-Max (IDM):

    480 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

STW160N75F3 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the STW160N75F3 is not explicitly stated in the datasheet, but it can be determined by consulting the application notes and thermal design guidelines provided by STMicroelectronics. Typically, the SOA is defined by the maximum voltage, current, and temperature ratings of the device.
  • To ensure the reliability of the STW160N75F3 in high-temperature applications, it is essential to follow the recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and cooling systems. Additionally, the device should be operated within the specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • The recommended PCB layout and design considerations for the STW160N75F3 include using a multi-layer PCB with a solid ground plane, minimizing trace lengths and widths, and using thermal vias to improve heat dissipation. Additionally, the device should be placed in a location that minimizes thermal coupling with other components, and the PCB should be designed to minimize electromagnetic interference (EMI).
  • To select the correct gate driver for the STW160N75F3, consider the device's gate charge, gate-source voltage, and switching frequency requirements. The gate driver should be able to provide the necessary current and voltage to ensure proper switching of the device. Additionally, the gate driver should be compatible with the device's logic level and have a sufficient isolation voltage rating.
  • The STW160N75F3 has built-in ESD protection, but it is still essential to follow proper ESD handling precautions during assembly, storage, and handling. This includes using ESD-safe materials, grounding straps, and wrist straps, and minimizing the exposure of the device to static electricity.

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STW160N75F3 Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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