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SUD09P10-195-GE3 - Vishay

Description: MOSFET -100V 195mOhms@ 10V -8.8A

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SUD09P10-195-GE3 Details

  • Manufacturer Part Number:

    SUD09P10-195-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    16.2 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    8.8 A

  • Drain-source On Resistance-Max:

    0.195 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    32.1 W

  • Pulsed Drain Current-Max (IDM):

    15 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SUD09P10-195-GE3 Frequently Asked Questions (FAQs)

  • The recommended soldering temperature profile for SUD09P10-195-GE3 is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s.
  • Yes, SUD09P10-195-GE3 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • SUD09P10-195-GE3 is rated for operation up to 150°C, but its capacitance and ESR may degrade at high temperatures. Consult the datasheet for derating information.
  • Yes, SUD09P10-195-GE3 is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended land pattern for SUD09P10-195-GE3 is a rectangular pad with a minimum size of 2.5 mm x 1.5 mm, with a non-solder mask defined (NSMD) pad shape.

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SUD09P10-195-GE3 Overview

Use the download button to access the SUD09P10-195-GE3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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