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SURD8530T4G-VF01 - onsemi

Description: Switch-mode Power Rectifier , Diode 300 V 5A Surface Mount DPAK , -65°C ~ 175°C

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SURD8530T4G-VF01 - onsemi PCB footprint - Other - Other - DPAK3 6.10x6.54x2.28, 2.29P CASE 369C ISSUE J_2026-1.2
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SURD8530T4G-VF01 Details

  • Manufacturer Part Number:

    SURD8530T4G-VF01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DPAK-3/2

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    11 Weeks

  • Date Of Intro:

    2017-06-23

  • Manufacturer:

    onsemi

  • YTEOL:

    6.45

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    ULTRA FAST RECOVERY POWER

  • Breakdown Voltage-Min:

    300 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    75 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    300 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    300 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SURD8530T4G-VF01 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, with thermal vias connecting to the top layer. This helps to dissipate heat efficiently. Additionally, it's recommended to have a minimum of 2oz copper thickness and to avoid routing high-frequency signals near the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation. It's also crucial to ensure good airflow and to avoid exposing the device to extreme temperatures during storage or handling.
  • The recommended soldering conditions for SURD8530T4G-VF01 are a peak temperature of 260°C (500°F) for a maximum of 10 seconds, with a soldering time of 3-5 seconds. It's essential to follow the recommended soldering profile to avoid damaging the device.
  • To troubleshoot EMI issues, start by ensuring that the device is properly grounded and that the PCB layout follows good EMI design practices. Use a spectrum analyzer to identify the frequency of the interference, and then implement EMI mitigation techniques such as shielding, filtering, or rerouting of signals.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to follow the recommended operating conditions to ensure reliable operation and to avoid voiding the device warranty.

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SURD8530T4G-VF01 Overview

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