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SY89323LMG-TR - Microchip

Description: Translation - Voltage Levels

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SY89323LMG-TR - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-PIN ULTRA -SMALL EPAD
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SY89323LMG-TR - Microchip  - 3D model - Small Outline No-lead - 8-PIN ULTRA -SMALL EPAD
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SY89323LMG-TR Details

  • Manufacturer Part Number:

    SY89323LMG-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    VDFN-8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Delay-Max:

    2.5 ns

  • Interface IC Type:

    PECL TO TTL TRANSLATOR

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Latch or Register:

    NONE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.9754 mm

  • Supply Current-Max:

    30 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

SY89323LMG-TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Use a thermal pad or a heat sink to dissipate heat, and ensure good airflow around the device. Also, follow the recommended operating conditions and derating guidelines in the datasheet.
  • Operating at a lower input voltage may reduce the output voltage and affect the device's performance. Operating at a higher input voltage may increase power consumption and reduce the device's lifespan.
  • Check the input voltage, output load, and PCB layout. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to measure the output voltage and check for noise or oscillations.
  • Yes, but ensure that you follow the recommended design and testing guidelines for high-reliability or safety-critical applications. Also, consult with Microchip's technical support and review the device's reliability and quality data.

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SY89323LMG-TR Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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