Description:250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
The recommended land pattern for the SZBZX84C4V7LT3G can be found in the onsemi packaging guidelines document or through consultation with onsemi's application engineers.
Follow the recommended soldering profile and guidelines provided in the onsemi packaging guidelines document, and ensure the PCB is designed with a compatible footprint and thermal relief patterns.
The SZBZX84C4V7LT3G has a thermal resistance of 30°C/W. Ensure proper thermal management by providing adequate heat sinking, thermal interfaces, and airflow to prevent overheating.
Yes, the SZBZX84C4V7LT3G is qualified for automotive and high-reliability applications. However, consult with onsemi's application engineers to ensure the device meets the specific requirements of your application.
Follow proper ESD handling procedures, such as using ESD-safe workstations, wrist straps, and packaging materials, to prevent damage to the device.
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SZBZX84C4V7LT3G Overview
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