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SZNUD3112LT1G - onsemi

Description: Relay Driver, 12 V

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SZNUD3112LT1G - onsemi  - 3D model
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SZNUD3112LT1G Details

  • Manufacturer Part Number:

    SZNUD3112LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.5 A

  • Output Peak Current Limit-Nom:

    0.4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.11 mm

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    14 V

  • Supply Voltage-Nom:

    16 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.091 µs

  • Turn-on Time:

    0.021 µs

  • Width:

    1.3 mm

SZNUD3112LT1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to ensure good heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the device and heat sink, and follow the recommended operating conditions and derating guidelines.
  • Handle the device by the body or pins, avoid touching the die, and use an ESD wrist strap or mat. Follow standard ESD handling procedures to prevent damage.
  • Yes, the SZNUD3112LT1G is AEC-Q101 qualified and suitable for high-reliability and automotive applications. However, ensure compliance with specific industry standards and regulations.
  • Use a logic analyzer or oscilloscope to monitor signals, check for proper power supply and decoupling, and verify correct pin connections and signal integrity.

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SZNUD3112LT1G Overview

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