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SZSM12T1G - onsemi

Description: ESD Protection Dual Common Anode Diodes 12 V, SOT-23

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SZSM12T1G - onsemi  - 3D model
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SZSM12T1G Details

  • Manufacturer Part Number:

    SZSM12T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Max:

    15.75 V

  • Breakdown Voltage-Min:

    13.3 V

  • Breakdown Voltage-Nom:

    14.53 V

  • Clamping Voltage-Max:

    19 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SZSM12T1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the bottom layer of the PCB, connected to the thermal pad of the SZSM12T1G. This helps to dissipate heat efficiently. Additionally, it's recommended to have a minimum of 2oz copper thickness and to avoid any thermal vias or holes under the device.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and to avoid any thermal hotspots on the PCB.
  • The recommended soldering profile for the SZSM12T1G is a peak temperature of 260°C (500°F) with a dwell time of 10-30 seconds. It's essential to follow the recommended soldering profile to avoid damaging the device. A slower ramp-up and ramp-down rate can help reduce thermal stress on the device.
  • To handle ESD protection for the SZSM12T1G, it's recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD arrays, to the PCB design to protect the device from electrostatic discharge.
  • The recommended storage condition for the SZSM12T1G is to store the devices in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -40°C to 125°C (-40°F to 257°F), and the humidity should be below 60%. It's also recommended to store the devices in their original packaging or in a sealed bag to prevent moisture absorption.

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SZSM12T1G Overview

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