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TDA8920BTH - NXP

Description: plastic, heatsink small outline package; 24 leads; low stand-off height

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TDA8920BTH - NXP - PCB symbol
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TDA8920BTH - NXP PCB footprint - Small Outline Packages - Small Outline Packages - TDA8920BTH
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TDA8920BTH - NXP - 3D model - Small Outline Packages - TDA8920BTH
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TDA8920BTH Details

  • Manufacturer Part Number:

    TDA8920BTH

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    PLASTIC, SOT-566-3, HSOP-24

  • Pin Count:

    24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    22 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • Gain:

    30 dB

  • Harmonic Distortion:

    10%

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    15.9 mm

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    110 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSSOP

  • Package Equivalence Code:

    SOP24,.56,40

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max (Vsup):

    30 V

  • Supply Voltage-Min (Vsup):

    12.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    DUAL

  • Width:

    11 mm

TDA8920BTH Frequently Asked Questions (FAQs)

  • A good PCB layout for the TDA8920BTH involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a shielded enclosure and keep the PCB away from other noise-generating components.
  • To optimize thermal performance, ensure good airflow around the device, use a heat sink if possible, and avoid blocking the airflow around the device. Also, keep the device away from other heat-generating components and use a thermal interface material (TIM) between the device and the heat sink.
  • The TDA8920BTH has built-in diagnostic features such as over-temperature protection, over-current protection, and under-voltage protection. The recommended settings for these features depend on the specific application, but generally, it's recommended to set the over-temperature threshold to around 150°C, the over-current threshold to around 2A, and the under-voltage threshold to around 10V.
  • To ensure proper biasing, follow the recommended voltage and current settings in the datasheet. Typically, the device requires a supply voltage of 12V to 15V, and the recommended bias current is around 10mA. Also, ensure that the input and output stages are properly terminated and matched to the load impedance.
  • To protect the TDA8920BTH from electrostatic discharge (ESD), use ESD-sensitive handling procedures, such as using an anti-static wrist strap or mat, and storing the device in an anti-static bag. Additionally, use ESD protection devices such as TVS diodes or ESD protection arrays on the PCB.

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TDA8920BTH Overview

Use the download button to access the TDA8920BTH schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TDA89, or try a keyword search, such as Audio/Video Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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