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TFDU6300-TR3 - Vishay

Description: TXRX IRDA 4MBIT 2.5MM SIDE 8-SMD

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TFDU6300-TR3 Details

  • Manufacturer Part Number:

    TFDU6300-TR3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    8.50 X 2.50 MM, 3.10 MM HEIGHT, ROHS COMPLIANT, MODULE, 8 PIN

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-XSMA-L8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.4 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    2.4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    L BEND

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

TFDU6300-TR3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the TFDU6300-TR3 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad shape.
  • The TFDU6300-TR3 has a thermal resistance of 25°C/W. To handle thermal management, ensure good airflow around the component, use a heat sink if necessary, and avoid blocking the airflow around the component. Also, ensure that the PCB is designed to dissipate heat efficiently.
  • The recommended soldering profile for the TFDU6300-TR3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, the TFDU6300-TR3 is suitable for high-frequency applications up to 1 GHz. However, the component's performance may degrade at higher frequencies due to parasitic inductance and capacitance. Ensure that the PCB design and component placement are optimized for high-frequency operation.
  • To ensure the reliability of the TFDU6300-TR3 in harsh environments, follow the recommended storage and handling procedures, and ensure that the component is operated within its specified temperature range. Also, consider using conformal coating or potting to protect the component from moisture and contaminants.

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TFDU6300-TR3 Overview

Use the download button to access the TFDU6300-TR3 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like TFDU6, or try a keyword search, such as Other Interface ICs

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Part Image TFDU6300-TR1 Vishay Intertechnologies

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