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TN2640N3-G - Microchip

Description: N-Channel 400 V 220mA (Tj) 740mW (Ta) Through Hole TO-92-3

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PCB Footprints
TN2640N3-G - Microchip PCB footprint - Other - Other - 3-Lead TO-92_2024-7
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TN2640N3-G - Microchip  - 3D model - Other - 3-Lead TO-92_2024-7
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TN2640N3-G Details

  • Manufacturer Part Number:

    TN2640N3-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-92,3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-92-3

  • Country Of Origin:

    Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    400 V

  • Drain Current-Max (ID):

    0.22 A

  • Drain-source On Resistance-Max:

    5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    15 pF

  • JESD-30 Code:

    O-PBCY-W3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    0.74 W

  • Power Dissipation-Max (Abs):

    0.74 W

  • Pulsed Drain Current-Max (IDM):

    2 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    52 ns

  • Turn-on Time-Max (ton):

    35 ns

TN2640N3-G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermocouple for temperature monitoring.
  • Use a shielded enclosure, and ensure proper grounding and decoupling. Implement a common-mode choke and EMI filters on the input and output lines. Follow good PCB layout practices, such as separating analog and digital circuits.
  • Use the device's built-in power-saving features, such as the low-power mode. Optimize the system's clock frequency and voltage supply. Consider using a DC-DC converter for efficient power conversion.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Ensure proper probe placement and grounding. Use a high-impedance oscilloscope probe to minimize loading effects.

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TN2640N3-G Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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