TSHG6400 footprint, schematic symbol and 3D model by Vishay

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TSHG6400 Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Avoid using excessive soldering temperatures or prolonged exposure to heat.
The maximum allowed voltage transient is 1.5 times the maximum rated voltage (VDRM) for a duration of 10 ms. Exceeding this may damage the device.
Yes, but ensure that the switching frequency is within the recommended range (typically up to 100 kHz). Exceeding this frequency may lead to increased losses and reduced device lifespan.
Handle the device with ESD-protective equipment and follow proper ESD-handling procedures. Use an ESD-protective bag or wrapping material for storage and transportation.

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