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TSI721A1-16GIL - Renesas Electronics

Description: The Tsi721 converts from PCIe to RapidIO and vice versa and provides full line rate bridging at 20 Gbaud. Using the Tsi721 designers can develop heterogeneous systems that leverage the peer to peer networking performance of RapidIO while at the same time using multiprocessor clusters that may only be PCIe enabled. Using the Tsi721, applications that require large amounts of data transferred efficiently without processor involvement can be executed using the full line rate block DMA+Messaging engines of the

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TSI721A1-16GIL - Renesas Electronics - PCB symbol
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PCB Footprints
TSI721A1-16GIL - Renesas Electronics PCB footprint - BGA - BGA - HMH143
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3D Models
TSI721A1-16GIL - Renesas Electronics - 3D model - BGA - HMH143
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TSI721A1-16GIL Details

  • Manufacturer Part Number:

    TSI721A1-16GIL

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FCBGA

  • Pin Count:

    143

  • Manufacturer Package Code:

    HM143

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B143

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    143

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA143,12X12,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Seated Height-Max:

    2.15 mm

  • Supply Current-Max:

    3000 mA

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    PACKET ROUTING SWITCH

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    13 mm

TSI721A1-16GIL Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN4393EJ0100) which includes thermal vias, thermal pads, and heat sink recommendations to ensure optimal thermal performance.
  • The TSI721A1-16GIL has an internal overcurrent protection (OCP) feature that can be enabled by setting the OCP threshold through the I2C interface. Additionally, an external OCP circuit can be implemented using a sense resistor and a comparator to detect overcurrent conditions.
  • The recommended power-up sequence is to first power up the VCC pin, followed by the VDD pin, and then the EN pin. This ensures that the internal voltage regulators are properly initialized and the device is configured correctly.
  • To troubleshoot I2C interface issues, check the I2C bus voltage levels, clock frequency, and signal integrity. Use an oscilloscope or logic analyzer to verify the I2C signals and ensure that the slave address is correctly set. Also, check the I2C bus pull-up resistors and ensure that they are within the recommended range.
  • The TSI721A1-16GIL has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure that the device is properly heat-sinked and that the thermal design is adequate to prevent overheating.

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TSI721A1-16GIL Overview

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