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US1D-13-F - Diodes Incorporated

Description: Diodes Inc US1D-13-F Switching Diode, 1A 200V, 2-Pin SMA

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US1D-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMA_
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US1D-13-F Details

  • Manufacturer Part Number:

    US1D-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

US1D-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the US1D-13-F is a standard SOD-123 package footprint with a 1.7mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Avoid overheating or applying excessive force, which can damage the device.
  • The US1D-13-F has an operating temperature range of -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • Yes, the US1D-13-F is AEC-Q101 qualified, making it suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure optimal performance and reliability.
  • To prevent electrostatic discharge (ESD) damage, handle the US1D-13-F with an anti-static wrist strap or mat, and ensure the PCB and components are properly grounded. Avoid touching the device's pins or handling it in environments with high electrostatic potential.

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US1D-13-F Overview

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For a full list of alternate parts for US1D-13-F, check out Findchips.com