VLHW5100 footprint, schematic symbol and 3D model by Vishay

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VLHW5100 Details

A thermal pad on the bottom of the package is recommended for optimal thermal performance. A minimum of 2 oz copper thickness and a thermal relief pattern on the PCB is suggested.
Use a wire bonding process with a minimum bonding force of 20-30 grams and a bonding temperature of 150-180°C. Ensure the wire is clean and free of oxidation.
The maximum allowable voltage stress on the device is 1.5 times the rated voltage. Exceeding this may cause permanent damage to the device.
Store the devices in a dry, nitrogen-filled package or a moisture barrier bag. Handle the devices in a dry, static-free environment, and avoid exposing them to high humidity or temperature fluctuations.
A reflow soldering profile with a peak temperature of 260°C, a dwell time of 30-60 seconds, and a ramp rate of 3°C/second is recommended.

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