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VND5004A-E - STMicroelectronics

Description: Double 4mOhm high side driver with analog current sense for automotive applications

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VND5004A-E Details

  • Manufacturer Part Number:

    VND5004A-E

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    PQFN-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    15 A

  • Output Peak Current Limit-Nom:

    100 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    SOLCC24,.47,37

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    27 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    13 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.9 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

VND5004A-E Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the VND5004A-E is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance and reliability.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder with a melting point above 217°C and a flux that is compatible with the device's package. It's also recommended to use a reflow oven or a soldering iron with a temperature control to prevent overheating.
  • The recommended PCB layout and spacing for the VND5004A-E can be found in the datasheet's package information section. It's essential to follow the recommended layout and spacing to ensure proper thermal dissipation, reduce electromagnetic interference (EMI), and prevent electrical shorts.
  • To handle the VND5004A-E's ESD sensitivity, follow proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in ESD-protective packaging. It's also recommended to use ESD-protected equipment and tools during assembly and testing.
  • The recommended test and measurement procedures for the VND5004A-E can be found in the datasheet's test and measurement section. It's essential to follow these procedures to ensure accurate and reliable results. Additionally, use calibrated test equipment and follow proper measurement techniques to prevent errors and damage to the device.

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VND5004A-E Overview

Use the download button to access the VND5004A-E 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like VND50, or try a keyword search, such as Peripheral Drivers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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