The recommended land pattern for WLPH201610M1R0PP is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad and a solder mask opening of 2.2mm x 1.0mm.
Yes, WLPH201610M1R0PP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to follow the recommended derating guidelines to ensure reliable operation.
The MSL of WLPH201610M1R0PP is MSL 3, which means it can withstand up to 168 hours of exposure to 30°C/60% RH before soldering.
Yes, WLPH201610M1R0PP is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile to ensure reliable joints.
The typical ESL of WLPH201610M1R0PP is around 0.5nH to 1.0nH, depending on the frequency and operating conditions. This value can be critical in high-frequency applications, and it's recommended to consult the manufacturer's application notes for more information.
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WLPH201610M1R0PP Overview
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