The recommended land pattern for WLPH201610M2R2PP is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape and a solder mask opening of 2.3mm x 1.05mm.
Yes, WLPH201610M2R2PP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to follow the recommended derating guidelines to ensure reliable operation.
The MSL of WLPH201610M2R2PP is MSL 3, which means it can withstand up to 168 hours of exposure to 30°C/60% RH before soldering. Proper handling and storage procedures should be followed to prevent moisture absorption.
Yes, WLPH201610M2R2PP is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature guidelines to ensure reliable joints.
The typical power dissipation of WLPH201610M2R2PP is around 1.5W, but it can vary depending on the operating frequency, voltage, and current. It's essential to perform thermal analysis and design considerations to ensure reliable operation.
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WLPH201610M2R2PP Overview
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