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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSL0805R0100FBA
- Part Number WSL0805R0100FBA
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSL0805R0100FBA Details
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Manufacturer Part Number:
WSL0805R0100FBA
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Rohs Code:
No
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Israel, USA
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
6 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
8
WSL0805R0100FBA Frequently Asked Questions (FAQs)
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The recommended land pattern for WSL0805R0100FBA is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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WSL0805R0100FBA has a maximum operating temperature of 150°C, making it suitable for most industrial and commercial applications. However, it's essential to ensure that the component is not exposed to temperatures above 150°C for an extended period to prevent degradation or failure.
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To prevent damage, handle WSL0805R0100FBA by the edges or the body, avoiding touching the termination areas. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Also, avoid bending or flexing the component during assembly.
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The recommended soldering profile for WSL0805R0100FBA is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of component damage.
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WSL0805R0100FBA has a moisture sensitivity level (MSL) of 1, which means it can withstand normal humidity levels. However, it's essential to follow proper storage and handling procedures to prevent moisture absorption, which can lead to component failure.
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WSL0805R0100FBA Overview
Use the download button to access the WSL0805R0100FBA 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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