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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0603R0330FEB
- Part Number WSLP0603R0330FEB
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0603R0330FEB Details
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Manufacturer Part Number:
WSLP0603R0330FEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
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Additional Feature:
ANTI-SULFUR
WSLP0603R0330FEB Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0603R0330FEB is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's dimensions and thermal considerations.
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To handle thermal considerations for WSLP0603R0330FEB, ensure that the PCB design provides adequate thermal relief paths to dissipate heat generated by the resistor. This can be achieved by using thermal vias, thermal pads, or increasing the copper thickness around the component.
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The moisture sensitivity level (MSL) of WSLP0603R0330FEB is MSL 1, which means it can withstand a maximum of 30°C/60% RH for 168 hours without being exposed to moisture-related failures.
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Yes, WSLP0603R0330FEB is suitable for high-frequency applications up to 1 GHz due to its thin-film construction and low inductance. However, it's essential to consider the component's self-resonant frequency and parasitic effects in the circuit design.
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The recommended soldering profile for WSLP0603R0330FEB is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 3°C/s and a ramp-down rate of 6°C/s. It's essential to follow the soldering profile to prevent damage to the component.
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WSLP0603R0330FEB Overview
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