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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for WSLP0603R0500DEA
- Part Number WSLP0603R0500DEA
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0603R0500DEA Details
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Manufacturer Part Number:
WSLP0603R0500DEA
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
13
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Additional Feature:
ANTI-SULFUR
WSLP0603R0500DEA Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0603R0500DEA is a rectangular pad with a size of 0.6 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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WSLP0603R0500DEA has a maximum operating temperature of 150°C. While it can tolerate high temperatures, it's essential to ensure that the component is not exposed to temperatures above the recommended maximum to prevent degradation or failure.
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Handle WSLP0603R0500DEA by the edges or the body, avoiding touching the termination pads to prevent damage from electrostatic discharge (ESD). Use anti-static wrist straps, mats, or other ESD protection devices during assembly.
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The recommended soldering profile for WSLP0603R0500DEA is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is within the recommended temperature range to prevent damage or degradation.
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WSLP0603R0500DEA has a moisture sensitivity level (MSL) of 1, which means it can withstand normal humidity levels. However, it's essential to ensure that the component is not exposed to extreme humidity or moisture, which can cause degradation or failure.
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WSLP0603R0500DEA Overview
Use the download button to access the WSLP0603R0500DEA 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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