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- Stock & Prices $ Price & Stock for WSLP0603R0510FEA
- Part Number WSLP0603R0510FEA
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
WSLP0603R0510FEA Details
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Manufacturer Part Number:
WSLP0603R0510FEA
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
12
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Additional Feature:
ANTI-SULFUR
WSLP0603R0510FEA Frequently Asked Questions (FAQs)
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The recommended land pattern for WSLP0603R0510FEA is a rectangular pad with a size of 0.6 mm x 0.3 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
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While WSLP0603R0510FEA is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at elevated temperatures. Additionally, the PCB material and soldering process should be suitable for high-temperature applications.
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To prevent ESD damage, it's recommended to handle WSLP0603R0510FEA with ESD-protective equipment, such as wrist straps, mats, and bags. Additionally, ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, to protect the component from electrostatic discharge.
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The recommended soldering process for WSLP0603R0510FEA is a reflow soldering process with a peak temperature of 260°C and a dwell time of 20-30 seconds. It's essential to follow the soldering profile recommended by the manufacturer to ensure reliable solder joints.
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While WSLP0603R0510FEA is not hermetically sealed, it's designed to operate in a normal environment with a relative humidity of up to 60%. However, if the component will be exposed to high humidity or moisture, it's recommended to apply a conformal coating or potting compound to protect it from corrosion.
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WSLP0603R0510FEA Overview
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