The recommended land pattern for the WW3JT24R0 is a rectangular pad with a size of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm solder mask clearance.
To ensure proper thermal management, it is recommended to use a thermal pad or a heat sink with a thermal interface material (TIM) to dissipate heat. The thermal pad should be at least 1mm thick and have a thermal conductivity of 1W/m-K or higher.
The maximum operating temperature range for the WW3JT24R0 is -40°C to 150°C, with a derating of 1.33% per degree above 125°C.
Yes, the WW3JT24R0 is designed to withstand high-vibration environments. However, it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB.
To ensure reliability in a humid environment, it is recommended to apply a conformal coating to the PCB and to follow the manufacturer's guidelines for moisture sensitivity level (MSL) handling and storage.
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WW3JT24R0 Overview
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