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XA7Z030-1FBV484Q - AMD

Description: Processors - Application Specialized XA7Z030-1FBV484Q

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PCB Footprints
XA7Z030-1FBV484Q - AMD PCB footprint - BGA - BGA - FBG484
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XA7Z030-1FBV484Q - AMD  - 3D model - BGA - FBG484
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XA7Z030-1FBV484Q Details

  • Manufacturer Part Number:

    XA7Z030-1FBV484Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBV-484

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • JESD-30 Code:

    S-PBGA-B484

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Screening Level:

    AEC-Q100

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XA7Z030-1FBV484Q Frequently Asked Questions (FAQs)

  • The XA7Z030-1FBV484Q has an industrial temperature range of -40°C to 100°C, making it suitable for a wide range of applications.
  • The XA7Z030-1FBV484Q has a built-in DDR3 memory controller, and you can use the Xilinx Memory Interface Generator (MIG) tool to generate the necessary IP cores and interface logic.
  • The XA7Z030-1FBV484Q has a maximum clock frequency of 450 MHz, but this can vary depending on the specific application and design implementation.
  • Yes, the XA7Z030-1FBV484Q has built-in transceivers that support high-speed serial interfaces like PCIe Gen2 and SATA II, making it suitable for applications that require high-speed data transfer.
  • You can use the Xilinx Vivado Design Suite to program and debug the XA7Z030-1FBV484Q. The Vivado suite provides a comprehensive development environment for designing, implementing, and testing FPGA-based systems.

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XA7Z030-1FBV484Q Overview

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