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XAZU3EG-1SFVC784I - AMD

Description: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 154K+ Logic Cells 500MHz, 1.2GHz 784-FCBGA (23x23)

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XAZU3EG-1SFVC784I - AMD PCB footprint - BGA - BGA - 784-FCBGA (23x23)
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XAZU3EG-1SFVC784I - AMD  - 3D model - BGA - 784-FCBGA (23x23)
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XAZU3EG-1SFVC784I Details

  • Manufacturer Part Number:

    XAZU3EG-1SFVC784I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-784

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE SoC

XAZU3EG-1SFVC784I Frequently Asked Questions (FAQs)

  • The TDP is not explicitly stated in the datasheet, but based on similar parts from AMD, it's likely around 25-35W.
  • Consult the AMD power management guide for the specific family of parts, and consider using power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • Follow the guidelines in the AMD PCB design guide for the specific package type (e.g., BGA, LGA) and consult with experienced PCB designers to ensure optimal signal integrity and thermal performance.
  • Consult the AMD environmental specifications and reliability reports for the specific part family. You may need to consider additional design measures, such as thermal management, vibration damping, and component selection, to ensure reliability in harsh environments.
  • Use AMD's debugging tools and resources, such as the AMD Debug Tool (ADT) and the AMD Embedded Design Center. Consult the datasheet, user manuals, and application notes for troubleshooting guidance specific to the part.

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XAZU3EG-1SFVC784I Overview

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