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XAZU3EG-1SFVC784Q - AMD

Description: FPGA - Field Programmable Gate Array XAZU3EG-1SFVC784Q

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PCB Footprints
XAZU3EG-1SFVC784Q - AMD PCB footprint - BGA - BGA - SFVC784
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XAZU3EG-1SFVC784Q - AMD  - 3D model - BGA - SFVC784
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XAZU3EG-1SFVC784Q Details

  • Manufacturer Part Number:

    XAZU3EG-1SFVC784Q

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-784

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • JESD-30 Code:

    S-PBGA-B784

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    784

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    3.32 mm

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    PROGRAMMABLE SoC

XAZU3EG-1SFVC784Q Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for this device is typically between -40°C to 100°C, but it's essential to check the datasheet for specific temperature ratings.
  • To ensure signal integrity, follow the recommended PCB layout guidelines, use controlled impedance traces, and consider using signal conditioning components like terminators or filters.
  • The power sequencing requirements can be found in the datasheet, but generally, it's essential to power up the device in a specific order, such as powering up the core voltage before the I/O voltage.
  • To optimize power consumption, use the power-saving features provided by the device, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS).
  • The recommended decoupling capacitor values and placement can be found in the datasheet or application notes. Generally, place decoupling capacitors close to the device's power pins, and use a combination of high-frequency and low-frequency capacitors.

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XAZU3EG-1SFVC784Q Overview

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