XAZU3EG-L1SFVA625I - AMD

XAZU3EG-L1SFVA625I Details

• Manufacturer Part Number:

  XAZU3EG-L1SFVA625I

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  FCBGA-625

• HTS Code:

  8542.31.00.30

• Manufacturer:

  AMD

• JESD-30 Code:

  S-PBGA-B625

• JESD-609 Code:

  e1

• Length:

  21 mm

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  625

• Operating Temperature-Max:

  100 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  FBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, FINE PITCH

• Peak Reflow Temperature (Cel):

  250

• Seated Height-Max:

  3.43 mm

• Supply Voltage-Nom:

  0.72 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  21 mm

• uPs/uCs/Peripheral ICs Type:

  PROGRAMMABLE SoC