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XC3S200-4VQ100I - AMD

Description: FPGA - Field Programmable Gate Array 200000 SYSTEM GATE 1.2 VOLT FPGA

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XC3S200-4VQ100I - AMD PCB footprint - Quad Flat Packages - Quad Flat Packages - VQ100
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XC3S200-4VQ100I - AMD  - 3D model - Quad Flat Packages - VQ100
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XC3S200-4VQ100I Details

  • Manufacturer Part Number:

    XC3S200-4VQ100I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    16 X 16 MM, VQFP-100

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    630 MHz

  • Combinatorial Delay of a CLB-Max:

    0.61 ns

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e4

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    480

  • Number of Equivalent Gates:

    200000

  • Number of Inputs:

    63

  • Number of Logic Cells:

    4320

  • Number of Outputs:

    63

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    480 CLBS, 200000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

XC3S200-4VQ100I Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S200-4VQ100I is -40°C to 100°C (industrial grade) and 0°C to 85°C (commercial grade).
  • Xilinx provides a Clock Domain Crossing (CDC) user guide that explains how to implement CDC in their FPGAs, including the XC3S200. It involves using synchronizers, FIFOs, and other techniques to ensure reliable data transfer between clock domains.
  • The power consumption of XC3S200-4VQ100I depends on the specific application and usage. However, according to the datasheet, the typical power consumption is around 1.2W for the -4 speed grade, with a maximum power consumption of around 2.5W.
  • While the XC3S200-4VQ100I has high-speed transceivers, it is not suitable for high-speed serial interfaces like PCIe or SATA due to its limited bandwidth and lack of dedicated high-speed serial interface blocks. Xilinx's higher-end FPGAs, such as the Virtex series, are more suitable for these applications.
  • Xilinx provides a range of debugging and testing tools, including ChipScope, SignalTap, and the Vivado Design Suite. These tools allow you to monitor and analyze the internal signals of your design, as well as perform functional verification and testing.

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XC3S200-4VQ100I Overview

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Image Part Number Model
Part Image XC3S200-4VQG100C AMD Xilinx

Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PQFP100

Part Image XC3S200-4VQ100I AMD Xilinx

Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PQFP100

Part Image XC3S200-4VQ100C AMD Xilinx

Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PQFP100

Part Image XC3S200-4VQG100C AMD

Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PQFP100

Part Image XC3S200-4VQ100C AMD

Field Programmable Gate Array, 480 CLBs, 200000 Gates, 630MHz, 4320-Cell, CMOS, PQFP100

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