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XC3S50AN-4TQG144C - AMD

Description: Xilinx XC3S50AN-4TQG144C, FPGA Field Programmable Gate Array Spartan-3AN 1584 Cells, 50000 Gates, 11264bit, 1584 Blocks,

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XC3S50AN-4TQG144C Details

  • Manufacturer Part Number:

    XC3S50AN-4TQG144C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    0

  • Clock Frequency-Max:

    667 MHz

  • Combinatorial Delay of a CLB-Max:

    0.71 ns

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    176

  • Number of Equivalent Gates:

    50000

  • Number of Inputs:

    108

  • Number of Logic Cells:

    1584

  • Number of Outputs:

    101

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    176 CLBS, 50000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

XC3S50AN-4TQG144C Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for XC3S50AN-4TQG144C is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • To implement a CDC in XC3S50AN-4TQG144C, use a synchronizer circuit or a FIFO-based CDC, and ensure that the clock domains are properly isolated and synchronized.
  • The maximum current draw for XC3S50AN-4TQG144C is approximately 1.2A for the core voltage (VCCINT) and 0.5A for the I/O voltage (VCCO).
  • To configure XC3S50AN-4TQG144C for low power consumption, use the Xilinx Power Analyzer tool, reduce clock frequencies, use power-gating, and optimize the design for low power.
  • The maximum frequency for the clock input of XC3S50AN-4TQG144C is 350 MHz.

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XC3S50AN-4TQG144C Overview

Use the download button to access the XC3S50AN-4TQG144C 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like XC3S5, or try a keyword search, such as Field Programmable Gate Arrays

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Image Part Number Model
Part Image XC3S50A-4TQG144C AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PQFP144

Part Image XC3S50AN-4TQ144C AMD Xilinx

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 280MHz, CMOS, PQFP144

Part Image XC3S50AN-4TQ144C4100 AMD Xilinx

Field Programmable Gate Array, 667MHz, 1584-Cell, PQFP144

Part Image XC3S50A-4TQ144C AMD

Field Programmable Gate Array, 176 CLBs, 50000 Gates, 667MHz, 1584-Cell, CMOS, PQFP144

Part Image XC3S50AN-4TQ144C4100 AMD

Field Programmable Gate Array, 667MHz, 1584-Cell, PQFP144

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