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XC4VLX25-10FF668C - AMD

Description: FPGA - Field Programmable Gate Array XC4VLX25-10FF668C

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XC4VLX25-10FF668C - AMD PCB footprint - BGA - BGA - FF668 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VLX25-10FF668C - AMD  - 3D model - BGA - FF668 Flip-Chip Fine-Pitch BGA Package Specifications (1.00 mm pitch)
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XC4VLX25-10FF668C Details

  • Manufacturer Part Number:

    XC4VLX25-10FF668C

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-668

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    4

  • Clock Frequency-Max:

    1028 MHz

  • Combinatorial Delay of a CLB-Max:

    0.2 ns

  • JESD-30 Code:

    S-PBGA-B668

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    2688

  • Number of Inputs:

    448

  • Number of Logic Cells:

    24192

  • Number of Outputs:

    448

  • Number of Terminals:

    668

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2688 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA668,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.85 mm

  • Supply Voltage-Max:

    1.26 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    27 mm

XC4VLX25-10FF668C Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC4VLX25-10FF668C is 350 MHz, but it depends on the specific application, clock domain, and design implementation.
  • You can implement a DDR3 memory interface using the MIG (Memory Interface Generator) tool provided by Xilinx. The tool generates a customized IP core for the DDR3 interface, which can be integrated into your design.
  • The power consumption of the XC4VLX25-10FF668C depends on the specific application, clock frequency, and design implementation. However, according to the datasheet, the typical static power consumption is around 1.2W, and the dynamic power consumption can range from 1.5W to 3.5W.
  • Yes, the XC4VLX25-10FF668C is capable of supporting high-speed serial interfaces like PCIe and SATA. It has built-in transceivers that can operate at speeds up to 6.25 Gbps, making it suitable for these applications.
  • You can use Xilinx's ChipScope Pro tool to debug and verify your design on the XC4VLX25-10FF668C. ChipScope Pro provides a range of debugging and verification features, including signal tapping, trigger capabilities, and waveform analysis.

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XC4VLX25-10FF668C Overview

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Image Part Number Model
Part Image XC4VLX25-10FFG668C AMD Xilinx

Field Programmable Gate Array, 2688 CLBs, 1028MHz, 24192-Cell, CMOS, PBGA668

Part Image XC4VLX25-10FF668I AMD Xilinx

Field Programmable Gate Array, 2688 CLBs, 1028MHz, 24192-Cell, CMOS, PBGA668

Part Image XC4VLX25-10FFG668CS2 AMD Xilinx

Field Programmable Gate Array, 2688 CLBs, 1028MHz, 24192-Cell, CMOS, PBGA668

Part Image XC4VLX25-10FF668CS2 AMD Xilinx

Field Programmable Gate Array, 2688 CLBs, 1028MHz, 24192-Cell, CMOS, PBGA668

Part Image XC4VLX25-10FF668IS2 AMD Xilinx

Field Programmable Gate Array, 2688 CLBs, 1028MHz, 24192-Cell, CMOS, PBGA668

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