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XC5VFX130T-2FFG1738I - AMD

Description: FPGA - Field Programmable Gate Array XC5VFX130T-2FFG1738I

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XC5VFX130T-2FFG1738I - AMD PCB footprint - BGA - BGA - 1738 Ball Flip-Chip BGA_2026
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XC5VFX130T-2FFG1738I - AMD  - 3D model - BGA - 1738 Ball Flip-Chip BGA_2026
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XC5VFX130T-2FFG1738I Details

  • Manufacturer Part Number:

    XC5VFX130T-2FFG1738I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1738

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    AMD

  • YTEOL:

    6.3

  • Combinatorial Delay of a CLB-Max:

    0.77 ns

  • JESD-30 Code:

    S-PBGA-B1738

  • JESD-609 Code:

    e1

  • Length:

    42.5 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    10240

  • Number of Inputs:

    840

  • Number of Logic Cells:

    13172

  • Number of Outputs:

    840

  • Number of Terminals:

    1738

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    10240 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1738,42X42,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.25 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 65 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    42.5 mm

XC5VFX130T-2FFG1738I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XC5VFX130T-2FFG1738I is approximately 25W, depending on the operating conditions and usage.
  • To implement a reliable clocking scheme, use a clocking wizard to generate a stable clock signal, and consider using a clock domain crossing (CDC) to ensure data integrity across clock domains.
  • To optimize the design for area and speed, use the Vivado Design Suite to synthesize and implement the design, and apply optimization techniques such as pipelining, retiming, and resource sharing.
  • To ensure signal integrity in high-speed designs, use the Vivado Design Suite to analyze and optimize signal integrity, and consider using techniques such as differential signaling, termination, and shielding.
  • The recommended PCB layout guidelines for the XC5VFX130T-2FFG1738I include using a 4-layer or 6-layer PCB, following Xilinx's PCB design guidelines, and ensuring proper decoupling and power distribution.

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XC5VFX130T-2FFG1738I Overview

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Part Image XC5VFX130T-2FFG1738C AMD Xilinx

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Part Image XC5VFX130T-2FF1738C AMD Xilinx

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