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XC5VLX155T-1FFG1136I - AMD

Description: FPGA - Field Programmable Gate Array XC5VLX155T-1FFG1136I

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XC5VLX155T-1FFG1136I - AMD PCB footprint - BGA - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package_2023
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XC5VLX155T-1FFG1136I - AMD  - 3D model - BGA - 1136 Ball Flip-Chip BGA (FF1136) Package_2023
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XC5VLX155T-1FFG1136I Details

  • Manufacturer Part Number:

    XC5VLX155T-1FFG1136I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-1136

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    6.2

  • Combinatorial Delay of a CLB-Max:

    0.9 ns

  • JESD-30 Code:

    S-PBGA-B1136

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    4

  • Number of CLBs:

    12160

  • Number of Inputs:

    640

  • Number of Logic Cells:

    155648

  • Number of Outputs:

    640

  • Number of Terminals:

    1136

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    12160 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1136,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.25 mm

  • Supply Voltage-Max:

    1.05 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    65 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

XC5VLX155T-1FFG1136I Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the XC5VLX155T-1FFG1136I is 550 MHz, but it depends on the specific application, clock domain, and design implementation.
  • To optimize power consumption, use Xilinx's Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage scaling, and optimize your design for low power using techniques like pipelining and parallel processing.
  • The -1 speed grade has a faster maximum clock frequency (550 MHz) compared to the -2 speed grade (450 MHz), but the -2 speed grade has lower power consumption and is more suitable for power-sensitive applications.
  • Yes, the XC5VLX155T-1FFG1136I is suitable for high-reliability applications, as it is fabricated using a 65nm process and has built-in features like error correction and single-event upset (SEU) mitigation.
  • To ensure signal integrity, use Xilinx's ISE Design Suite to analyze and optimize your design for signal integrity, and follow best practices for PCB design, such as using differential signaling, adding termination resistors, and minimizing signal routing distances.

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XC5VLX155T-1FFG1136I Overview

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Part Image XC5VLX155T-1FF1136I AMD

Field Programmable Gate Array, 12160 CLBs, 155648-Cell, PBGA1136

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Part Image XC5VLX155T-1FFG1136I AMD Xilinx

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Part Image XC5VLX155T-1FF1136C AMD Xilinx

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Part Image XC5VLX155T-1FF1136I AMD Xilinx

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