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XCZU15EG-2FFVC900I - AMD

Description: FPGA - Field Programmable Gate Array XCZU15EG-2FFVC900I

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XCZU15EG-2FFVC900I - AMD PCB footprint - BGA - BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
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XCZU15EG-2FFVC900I - AMD  - 3D model - BGA - FFVC900 Flip-Chip, Fine-Pitch BGA
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XCZU15EG-2FFVC900I Details

  • Manufacturer Part Number:

    XCZU15EG-2FFVC900I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-900

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B900

  • JESD-609 Code:

    e1

  • Number of Terminals:

    900

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU15EG-2FFVC900I Frequently Asked Questions (FAQs)

  • The maximum power consumption of the XCZU15EG-2FFVC900I is approximately 25W, but it can vary depending on the specific design, clock frequency, and operating conditions.
  • To optimize power consumption, use the Vivado Power Analysis tool, enable power gating, reduce clock frequencies, and use low-power modes when possible. Additionally, consider using the AMD Power Estimator (APE) tool to estimate power consumption early in the design cycle.
  • The maximum operating temperature of the XCZU15EG-2FFVC900I is 100°C (industrial grade) or 125°C (extended temperature range). However, it's recommended to operate the device within the recommended temperature range of 0°C to 85°C for optimal performance and reliability.
  • To ensure signal integrity, use the Vivado Design Suite to analyze and optimize signal routing, use differential signaling where possible, and follow the guidelines for signal termination and impedance matching provided in the datasheet and user guides.
  • The recommended PCB layout and stackup for the XCZU15EG-2FFVC900I can be found in the Xilinx PCB Design Guide (UG583) and the XCZU15EG-2FFVC900I Package and Pinout Specification (DS925). It's essential to follow these guidelines to ensure signal integrity, power integrity, and thermal management.

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XCZU15EG-2FFVC900I Overview

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