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XCZU7EV-2FFVC1156I - AMD

Description: FPGA - Field Programmable Gate Array XCZU7EV-2FFVC1156I

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XCZU7EV-2FFVC1156I - AMD - PCB symbol
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PCB Footprints
XCZU7EV-2FFVC1156I - AMD PCB footprint - BGA - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
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3D Models
XCZU7EV-2FFVC1156I - AMD - 3D model - BGA - FFVA1156 Flip-Chip, Fine-Pitch BGA (XCKU15P)
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XCZU7EV-2FFVC1156I Details

  • Manufacturer Part Number:

    XCZU7EV-2FFVC1156I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-1156

  • Country Of Origin:

    Taiwan

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    AMD

  • YTEOL:

    19

  • JESD-30 Code:

    R-PBGA-B1156

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    4

  • Number of Terminals:

    1156

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Supply Voltage-Max:

    0.876 V

  • Supply Voltage-Min:

    0.825 V

  • Supply Voltage-Nom:

    0.85 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • uPs/uCs/Peripheral ICs Type:

    SoC

XCZU7EV-2FFVC1156I Frequently Asked Questions (FAQs)

  • The maximum power consumption of XCZU7EV-2FFVC1156I is approximately 12W, but it can vary depending on the application and usage.
  • To optimize power consumption, use the Xilinx Power Estimator (XPE) tool to estimate power consumption, and then apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The maximum operating temperature of XCZU7EV-2FFVC1156I is 100°C (industrial grade) or 125°C (extended temperature grade).
  • To ensure signal integrity, use the Xilinx Vivado Design Suite to analyze and optimize signal integrity, and follow best practices for PCB design, such as using differential pairs, adding termination resistors, and minimizing trace lengths.
  • The maximum clock frequency of XCZU7EV-2FFVC1156I is 500 MHz, but it can vary depending on the specific application and design.

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XCZU7EV-2FFVC1156I Overview

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