Description: Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 16 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Layout Matrix | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | Dim