1-770872-1 - TE Connectivity
Description: Configuration Features: PCB Mount Orientation Vertical | Number of Positions 2 | Number of Rows 1 | Number of Power Positions 2 | Number of Signal Positions 0 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Layout Inline | Conta